Samsung Elec wins $200 billion Broadcom AI chip partnership, boosting foundry push

Winning long-term production commitments from Broadcom, one of the world's leading custom AI chip designers, could boost utilisation at Samsung's advanced manufacturing facilities to pull ahead in the ​race to supply AI chips.

The deal provides for Broadcom's next-generation communications chips, designed for high-speed data transfer, to be made with Samsung's sub-2-nanometre process technology, Samsung said.

Last month, co-CEO and ​chip division ⁠head Jun Young-hyun said he discussed next-generation foundry cooperation with Jensen Huang, chief executive of Nvidia, including future HBM4E and HBM5 memory products.